Effect of heat treatment temperature on SN-0.7CU solders material on microstructure

QR Code

Effect of heat treatment temperature on SN-0.7CU solders material on microstructure

Soldering plays the most important role for joining technology in electronic industry.The conventional tin-lead solders have been used for a quite long time in electronic industries.However,since lead is a toxic element and harmful to individual health and environment,many researchers have proposed...

Full description

Bibliographic Details
Main Author:	Nabhan, Ismil
Format:	Undergraduates Project Papers
Language:	English
Published:	2007
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/5152/ http://umpir.ump.edu.my/id/eprint/5152/1/Effect%20of%20heat%20treatment%20temperature%20on%20SN-0.7CU%20solders%20material%20on%20microstructure.PDF

Similar Items

Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
by: Ariff Syakirin, Ghazalli
Published: (2007)

Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
by: Ghani, Fitriah Abdul
Published: (2018)

Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
by: Siti Faqihah, Roduan, et al.
Published: (2023)

Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2017)

Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2017)

Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2020)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: M. A., Azmah Hanim, et al.
Published: (2020)

Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy
by: Tan, Joo Kean
Published: (2017)

A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)

Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test
by: Atiqah Mohd Afdzaluddin,, et al.
Published: (2020)

Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
by: Nadhrah, Murad
Published: (2021)

Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)

Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7 Cu lead-free solder alloy / Syed Hassan Abbas Jaffery
by: Syed Hassan , Abbas Jaffery
Published: (2017)

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)

Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)

Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
by: Lee, Liu Mei
Published: (2013)

Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
by: Ridhai, Mohammed Noori
Published: (2010)

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate
by: Tay, S., et al.
Published: (2013)

Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei
by: Leong , Yee Mei
Published: (2020)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)

Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)

A review on mechanical properties of SnAgCu/Cu joint using laser soldering
by: Nabila, Tamar Jaya, et al.
Published: (2018)

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: K., Vidyatharran, et al.
Published: (2021)

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)

Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint
by: Theophilus, Dele-Afolabi Temitope, et al.
Published: (2015)

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: Dele-Afolabi, Temitope T., et al.
Published: (2022)

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: Dele-Afolabi, T. T., et al.
Published: (2022)

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg
by: M.A., Rabiatul Adawiyah, et al.
Published: (2019)

Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
by: Shaffiar, Norhashimah, et al.
Published: (2010)

Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
by: Lee , Liu Mei
Published: (2013)

Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates
by: Mohd Izrul Izwan Ramli,, et al.
Published: (2020)

Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
by: Abu Bakar, Nur Adriana Nazifa
Published: (2019)

Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)