Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad

Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad

Laser technology has been applied in the electronic soldering for many years as one of its advantages known is the ability to set the process parameters to suit the individual solder joint requirements. This method of joining, ease the automation compared to the reflow soldering process which is the...

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Bibliographic Details
Main Author: Nabila, Tamar Jaya
Format: Thesis
Language:English
Published: 2024
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/44665/
http://umpir.ump.edu.my/id/eprint/44665/1/Study%20on%20intermetallic%20compound%20formation%20and%20growth%20at%20the%20solder%20joint%20interface%20during%20laser%20soldering%20using%20sn-ag-cu%20powdered%20compact%20solder%20on%20copper%20pad.pdf

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