Nabila, T. J. (2024). Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad.
Chicago Style (17th ed.) CitationNabila, Tamar Jaya. Study on Intermetallic Compound Formation and Growth at the Solder Joint Interface During Laser Soldering Using Sn-ag-cu Powdered Compact Solder on Copper Pad. 2024.
MLA (9th ed.) CitationNabila, Tamar Jaya. Study on Intermetallic Compound Formation and Growth at the Solder Joint Interface During Laser Soldering Using Sn-ag-cu Powdered Compact Solder on Copper Pad. 2024.
Warning: These citations may not always be 100% accurate.