Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis

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Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis

The increasing miniaturization of technology has intensified thermal challenges, particularly concerning the cooling of small components like integrated circuits and personal computer. In order to guarantee the safety and extended operation of these devices, the thermal performance...

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Bibliographic Details
Main Authors:	Muhammad Aidil Safwan, Abdul Aziz, Nofrizalidris, Darlis, Izuan Amin, Ishak, Nor Atiqah, Zolpakar, Mohammad Arafat, ., Muhammadu, Masin Muhammadu
Format:	Article
Language:	English
Published:	Semarak Ilmu Publishing 2024
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/44070/ http://umpir.ump.edu.my/id/eprint/44070/1/Thermal%20performance%20improvement%20of%20microchannel%20heat%20sink.pdf

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