Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis
The increasing miniaturization of technology has intensified thermal challenges, particularly concerning the cooling of small components like integrated circuits and personal computer. In order to guarantee the safety and extended operation of these devices, the thermal performance...
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| Format: | Article |
| Language: | English |
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Semarak Ilmu Publishing
2024
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| Online Access: | http://umpir.ump.edu.my/id/eprint/44070/ http://umpir.ump.edu.my/id/eprint/44070/1/Thermal%20performance%20improvement%20of%20microchannel%20heat%20sink.pdf |
| _version_ | 1848827024592863232 |
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| author | Muhammad Aidil Safwan, Abdul Aziz Nofrizalidris, Darlis Izuan Amin, Ishak Nor Atiqah, Zolpakar Mohammad Arafat, . Muhammadu, Masin Muhammadu |
| author_facet | Muhammad Aidil Safwan, Abdul Aziz Nofrizalidris, Darlis Izuan Amin, Ishak Nor Atiqah, Zolpakar Mohammad Arafat, . Muhammadu, Masin Muhammadu |
| author_sort | Muhammad Aidil Safwan, Abdul Aziz |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | The increasing miniaturization of technology has intensified thermal challenges, particularly concerning the cooling of small components like integrated circuits and personal computer. In order to guarantee the safety and extended operation of these devices, the thermal performance must be looked into with the purpose of dissipating them. One of the most common solutions is a microchannel heat sink (MCHS) because of its inherent property of a higher surface area-to-volume ratio. Microchannel heat sinks offer a common solution, but optimizing their configurations remains a subject of interest especially when incorporating multiple thermal enhancing methods within a microchannel heat sink. The objectives of the study is to analyse the effects of varying pin-fin geometries on key thermal performance metrics, such as maximum temperature and pressure drop, and also observing and comparing the streamline patterns generated within the crossflow microchannel heat sink. Computational Fluid Dynamics (CFD) simulations were conducted using Ansys to evaluate the thermal performance of different pin-fin geometries and also capture the streamlines pattern generated from the studied geometry of the pin fin. The results indicate that hexagon-shaped pin-fins reduced the maximum temperature by 1 to 3 Kelvin compared to the base model with circular pin-fins. However, while the circular pin-fins produced the lowest pressure drop, the hexagon-shaped pin-fins had the second-highest pressure drop among the geometries studied. This proves the significance of geometry selection for the pin fin as it affected the thermal performance of the microchannel heat sink with cross flow effects. |
| first_indexed | 2025-11-15T03:54:08Z |
| format | Article |
| id | ump-44070 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T03:54:08Z |
| publishDate | 2024 |
| publisher | Semarak Ilmu Publishing |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-440702025-03-14T07:39:38Z http://umpir.ump.edu.my/id/eprint/44070/ Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis Muhammad Aidil Safwan, Abdul Aziz Nofrizalidris, Darlis Izuan Amin, Ishak Nor Atiqah, Zolpakar Mohammad Arafat, . Muhammadu, Masin Muhammadu TJ Mechanical engineering and machinery The increasing miniaturization of technology has intensified thermal challenges, particularly concerning the cooling of small components like integrated circuits and personal computer. In order to guarantee the safety and extended operation of these devices, the thermal performance must be looked into with the purpose of dissipating them. One of the most common solutions is a microchannel heat sink (MCHS) because of its inherent property of a higher surface area-to-volume ratio. Microchannel heat sinks offer a common solution, but optimizing their configurations remains a subject of interest especially when incorporating multiple thermal enhancing methods within a microchannel heat sink. The objectives of the study is to analyse the effects of varying pin-fin geometries on key thermal performance metrics, such as maximum temperature and pressure drop, and also observing and comparing the streamline patterns generated within the crossflow microchannel heat sink. Computational Fluid Dynamics (CFD) simulations were conducted using Ansys to evaluate the thermal performance of different pin-fin geometries and also capture the streamlines pattern generated from the studied geometry of the pin fin. The results indicate that hexagon-shaped pin-fins reduced the maximum temperature by 1 to 3 Kelvin compared to the base model with circular pin-fins. However, while the circular pin-fins produced the lowest pressure drop, the hexagon-shaped pin-fins had the second-highest pressure drop among the geometries studied. This proves the significance of geometry selection for the pin fin as it affected the thermal performance of the microchannel heat sink with cross flow effects. Semarak Ilmu Publishing 2024-11-30 Article PeerReviewed pdf en cc_by_nc_4 http://umpir.ump.edu.my/id/eprint/44070/1/Thermal%20performance%20improvement%20of%20microchannel%20heat%20sink.pdf Muhammad Aidil Safwan, Abdul Aziz and Nofrizalidris, Darlis and Izuan Amin, Ishak and Nor Atiqah, Zolpakar and Mohammad Arafat, . and Muhammadu, Masin Muhammadu (2024) Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis. Journal of Advanced Research in Numerical Heat Transfer, 26 (1). pp. 84-98. ISSN 2735-0142. (Published) https://doi.org/10.37934/arnht.26.1.8498 https://doi.org/10.37934/arnht.26.1.8498 |
| spellingShingle | TJ Mechanical engineering and machinery Muhammad Aidil Safwan, Abdul Aziz Nofrizalidris, Darlis Izuan Amin, Ishak Nor Atiqah, Zolpakar Mohammad Arafat, . Muhammadu, Masin Muhammadu Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis |
| title | Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis |
| title_full | Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis |
| title_fullStr | Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis |
| title_full_unstemmed | Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis |
| title_short | Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis |
| title_sort | thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis |
| topic | TJ Mechanical engineering and machinery |
| url | http://umpir.ump.edu.my/id/eprint/44070/ http://umpir.ump.edu.my/id/eprint/44070/ http://umpir.ump.edu.my/id/eprint/44070/ http://umpir.ump.edu.my/id/eprint/44070/1/Thermal%20performance%20improvement%20of%20microchannel%20heat%20sink.pdf |