Effect of Zn nanoparticle-doped ﬂux on mechanical properties of SAC305 solder joint after electromigration

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Effect of Zn nanoparticle-doped ﬂux on mechanical properties of SAC305 solder joint after electromigration

Migration of Cu atoms from the cathode side to the anode side causes void formation in the solder joint, which is the root cause of electromigration failures in lead-free solder joints. This study investigates the effects of Zn nanoparticle-doped flux on the mechanical properties of SAC305 solder jo...

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Bibliographic Details
Main Authors:	Bashir, Muhammad Nasir, Khan, Niaz Bahadur, Bashir, Shahid, Khan, Abdul Faheem, Quazi, Moinuddin Mohammed, Gul, Mustabshirha, Wakeel, Saif, Hafiz Muhammad, Saad
Format:	Article
Language:	English English
Published:	Springer 2023
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics
Online Access:	http://umpir.ump.edu.my/id/eprint/42839/ http://umpir.ump.edu.my/id/eprint/42839/1/Effect%20of%20Zn%20nanoparticle-doped%20flux%20on%20mechanical%20properties.pdf http://umpir.ump.edu.my/id/eprint/42839/2/Effect%20of%20Zn%20nanoparticle-doped%20%EF%AC%82ux%20on%20mechanical%20properties%20of%20SAC305%20solder%20joint%20after%20electromigration_ABS.pdf

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