Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix
Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English English |
| Published: |
Springer
2022
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/42710/ http://umpir.ump.edu.my/id/eprint/42710/1/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure.pdf http://umpir.ump.edu.my/id/eprint/42710/2/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure%20of%20SAC305%20solder%20matrix_ABS.pdf |
| _version_ | 1848826682572537856 |
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| author | Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M. |
| author_facet | Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M. |
| author_sort | Bashir, Muhammad Nasir |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and β-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of β-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of β-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint. |
| first_indexed | 2025-11-15T03:48:42Z |
| format | Article |
| id | ump-42710 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-15T03:48:42Z |
| publishDate | 2022 |
| publisher | Springer |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-427102025-01-07T03:54:00Z http://umpir.ump.edu.my/id/eprint/42710/ Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M. T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and β-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of β-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of β-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint. Springer 2022-09 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/42710/1/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure.pdf pdf en http://umpir.ump.edu.my/id/eprint/42710/2/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure%20of%20SAC305%20solder%20matrix_ABS.pdf Bashir, Muhammad Nasir and Haseeb, Abdul S.Md Abdul and Wakeel, Saif and Khan, Muhammad Ali and Quazi, Moinuddin Mohammed and Khan, Niaz Bahadur and Ahmed, Arslan and Soudagar, Manzoore Elahi M. (2022) Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix. Journal of Materials Science: Materials in Electronics, 33 (25). pp. 20106-20120. ISSN 0957-4522. (Published) https://doi.org/10.1007/s10854-022-08827-0 https://doi.org/10.1007/s10854-022-08827-0 |
| spellingShingle | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M. Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix |
| title | Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix |
| title_full | Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix |
| title_fullStr | Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix |
| title_full_unstemmed | Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix |
| title_short | Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix |
| title_sort | effect of ni and co nanoparticle-doped flux on microstructure of sac305 solder matrix |
| topic | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics |
| url | http://umpir.ump.edu.my/id/eprint/42710/ http://umpir.ump.edu.my/id/eprint/42710/ http://umpir.ump.edu.my/id/eprint/42710/ http://umpir.ump.edu.my/id/eprint/42710/1/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure.pdf http://umpir.ump.edu.my/id/eprint/42710/2/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure%20of%20SAC305%20solder%20matrix_ABS.pdf |