Interfacial microstructure growth mechanism of lead-free solder using laser soldering

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Interfacial microstructure growth mechanism of lead-free solder using laser soldering

According to scientific evidence, plumbum (Pb) is recognized as a metal with the highest potential for adverse impacts on human health. For that, there was a growing emphasis on green electronics, particularly advanced electronic packaging technology, to promote societal health. As we know, green al...

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Bibliographic Details
Main Author:	Muhammad Asyraf, Abdullah
Format:	Thesis
Language:	English
Published:	2024
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/42470/ http://umpir.ump.edu.my/id/eprint/42470/1/ir.Interfacial%20microstructure%20growth%20mechanism%20of%20lead-free%20solder%20using%20laser%20soldering.pdf

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