Khairul, M. A., Muhamad, M. N., Asrulnizam, A. M., Kawarada, H., Shaili Falina, M. S., & Mohd Nasyriq, S. (2022). A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties. MDPI.
Chicago Style (17th ed.) CitationKhairul, Mohd Arshad, Mat Noor Muhamad, Abd Manaf Asrulnizam, Hiroshi Kawarada, Mohd Sukri Shaili Falina, and Syamsul Mohd Nasyriq. A Comparative Modelling Study of New Robust Packaging Technology 1 Mm2 VCSEL Packages and Their Mechanical Stress Properties. MDPI, 2022.
MLA (9th ed.) CitationKhairul, Mohd Arshad, et al. A Comparative Modelling Study of New Robust Packaging Technology 1 Mm2 VCSEL Packages and Their Mechanical Stress Properties. MDPI, 2022.
Warning: These citations may not always be 100% accurate.