The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating

Solder acts as a joining material in first level packaging such as controlled collapse chipconnection (C4). It helps to interconnect chip with substrate to provide electrical and mechanical continuity in electronic packaging. The quality of electronic packaging mostly relies on the solder joint that...

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Bibliographic Details
Main Author: Maliessa Nabilah, Mazelan
Format: Thesis
Language:English
Published: 2023
Subjects:
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/39614/
http://umpir.ump.edu.my/id/eprint/39614/1/ir.The%20effect%20of%20different%20Sn-Ag-Cu%20%28SAC%29%20solder%20form%20on%20solder.pdf

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