A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering

A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering

Reflow soldering is a process to create joining between the board and electronic component in order to make sure the electronic devices may function well. The aim of this study is to determine the solder joint strength through simulations using data from previous researchers. Two type of solder allo...

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Bibliographic Details
Main Authors: M. H., Mohd Zaki, S. R. A., Idris
Format: Conference or Workshop Item
Language:English
English
Published: Springer 2023
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/39416/
http://umpir.ump.edu.my/id/eprint/39416/1/A%20simulation%20study%20on%20interfacial%20reaction%20between%20Sn3Ag0.5Cu.pdf
http://umpir.ump.edu.my/id/eprint/39416/2/A%20simulation%20study%20on%20interfacial%20reaction%20between%20Sn3Ag0.5Cu_FULL.pdf

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