Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µ...
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| Format: | Article |
| Language: | English |
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MDPI
2023
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| Online Access: | http://umpir.ump.edu.my/id/eprint/38182/ http://umpir.ump.edu.my/id/eprint/38182/1/Effectiveness%20of%20Dimple%20Microtextured%20Copper%20Substrate%20on%20Performance%20of%20Sn-0.7Cu%20Solder%20Alloy.pdf |
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| author | Siti Faqihah, Roduan Juyana, A. Wahab Mohd Arif Anuar, Mohd Salleh Nurul Aida Husna, Mohd Mahayuddin Mohd Mustafa, Al Bakri Abdullah Aiman, Mohd Halil Amira Qistina Syamimi, Zaifuddin Mahadzir, Ishak Sandu, Andrei Victor Baltatu, Mădălina Simona Vizureanu, Petrica |
| author_facet | Siti Faqihah, Roduan Juyana, A. Wahab Mohd Arif Anuar, Mohd Salleh Nurul Aida Husna, Mohd Mahayuddin Mohd Mustafa, Al Bakri Abdullah Aiman, Mohd Halil Amira Qistina Syamimi, Zaifuddin Mahadzir, Ishak Sandu, Andrei Victor Baltatu, Mădălina Simona Vizureanu, Petrica |
| author_sort | Siti Faqihah, Roduan |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart. |
| first_indexed | 2025-11-15T03:28:59Z |
| format | Article |
| id | ump-38182 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T03:28:59Z |
| publishDate | 2023 |
| publisher | MDPI |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-381822023-09-04T07:07:01Z http://umpir.ump.edu.my/id/eprint/38182/ Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy Siti Faqihah, Roduan Juyana, A. Wahab Mohd Arif Anuar, Mohd Salleh Nurul Aida Husna, Mohd Mahayuddin Mohd Mustafa, Al Bakri Abdullah Aiman, Mohd Halil Amira Qistina Syamimi, Zaifuddin Mahadzir, Ishak Sandu, Andrei Victor Baltatu, Mădălina Simona Vizureanu, Petrica T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart. MDPI 2023-01 Article PeerReviewed pdf en cc_by_4 http://umpir.ump.edu.my/id/eprint/38182/1/Effectiveness%20of%20Dimple%20Microtextured%20Copper%20Substrate%20on%20Performance%20of%20Sn-0.7Cu%20Solder%20Alloy.pdf Siti Faqihah, Roduan and Juyana, A. Wahab and Mohd Arif Anuar, Mohd Salleh and Nurul Aida Husna, Mohd Mahayuddin and Mohd Mustafa, Al Bakri Abdullah and Aiman, Mohd Halil and Amira Qistina Syamimi, Zaifuddin and Mahadzir, Ishak and Sandu, Andrei Victor and Baltatu, Mădălina Simona and Vizureanu, Petrica (2023) Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy. Materials, 16 (96). pp. 1-14. ISSN 1996-1944. (Published) https://doi.org/10.3390/ma16010096 https://doi.org/10.3390/ma16010096 |
| spellingShingle | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Siti Faqihah, Roduan Juyana, A. Wahab Mohd Arif Anuar, Mohd Salleh Nurul Aida Husna, Mohd Mahayuddin Mohd Mustafa, Al Bakri Abdullah Aiman, Mohd Halil Amira Qistina Syamimi, Zaifuddin Mahadzir, Ishak Sandu, Andrei Victor Baltatu, Mădălina Simona Vizureanu, Petrica Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy |
| title | Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy |
| title_full | Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy |
| title_fullStr | Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy |
| title_full_unstemmed | Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy |
| title_short | Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy |
| title_sort | effectiveness of dimple microtextured copper substrate on performance of sn-0.7cu solder alloy |
| topic | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics |
| url | http://umpir.ump.edu.my/id/eprint/38182/ http://umpir.ump.edu.my/id/eprint/38182/ http://umpir.ump.edu.my/id/eprint/38182/ http://umpir.ump.edu.my/id/eprint/38182/1/Effectiveness%20of%20Dimple%20Microtextured%20Copper%20Substrate%20on%20Performance%20of%20Sn-0.7Cu%20Solder%20Alloy.pdf |