Siti Faqihah, R., Juyana, A. W., Mohd Arif Anuar, M. S., Nurul Aida Husna, M. M., Mohd Mustafa, A. B. A., Aiman, M. H., . . . Vizureanu, P. (2023). Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy. MDPI.
Chicago Style (17th ed.) CitationSiti Faqihah, Roduan, et al. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy. MDPI, 2023.
MLA (9th ed.) CitationSiti Faqihah, Roduan, et al. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy. MDPI, 2023.
Warning: These citations may not always be 100% accurate.