A review: effect of copper percentage solder alloy after laser soldering

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A review: effect of copper percentage solder alloy after laser soldering

Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface,...

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Bibliographic Details
Main Authors:	Asyraf, Abdullah, Siti Rabiatull Aisha, Idris
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2023
Subjects:	TS Manufactures
Online Access:	http://umpir.ump.edu.my/id/eprint/37468/ http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf

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