A review: effect of copper percentage solder alloy after laser soldering
Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface,...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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Emerald Group Publishing Limited
2023
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/37468/ http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf |
| _version_ | 1848825260128862208 |
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| author | Asyraf, Abdullah Siti Rabiatull Aisha, Idris |
| author_facet | Asyraf, Abdullah Siti Rabiatull Aisha, Idris |
| author_sort | Asyraf, Abdullah |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | Purpose
This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering.
Design/methodology/approach
This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed. |
| first_indexed | 2025-11-15T03:26:06Z |
| format | Article |
| id | ump-37468 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T03:26:06Z |
| publishDate | 2023 |
| publisher | Emerald Group Publishing Limited |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-374682023-04-12T08:45:54Z http://umpir.ump.edu.my/id/eprint/37468/ A review: effect of copper percentage solder alloy after laser soldering Asyraf, Abdullah Siti Rabiatull Aisha, Idris TS Manufactures Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed. Emerald Group Publishing Limited 2023 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf Asyraf, Abdullah and Siti Rabiatull Aisha, Idris (2023) A review: effect of copper percentage solder alloy after laser soldering. Soldering & Surface Mount Technology, ahead-of-print (ahead-of-print). pp. 1-29. ISSN 0954-0911. (Published) https://doi.org/10.1108/SSMT-03-2022-0022 https://doi.org/10.1108/SSMT-03-2022-0022 |
| spellingShingle | TS Manufactures Asyraf, Abdullah Siti Rabiatull Aisha, Idris A review: effect of copper percentage solder alloy after laser soldering |
| title | A review: effect of copper percentage solder alloy after laser soldering |
| title_full | A review: effect of copper percentage solder alloy after laser soldering |
| title_fullStr | A review: effect of copper percentage solder alloy after laser soldering |
| title_full_unstemmed | A review: effect of copper percentage solder alloy after laser soldering |
| title_short | A review: effect of copper percentage solder alloy after laser soldering |
| title_sort | review: effect of copper percentage solder alloy after laser soldering |
| topic | TS Manufactures |
| url | http://umpir.ump.edu.my/id/eprint/37468/ http://umpir.ump.edu.my/id/eprint/37468/ http://umpir.ump.edu.my/id/eprint/37468/ http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf |