Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die

Dicing operation in cutting hard-brittle ceramic die using nickel–diamond blade causes cracked or chipped die, accelerated tool wear and, ultimately, shortage of blade lifetime. This study aims to analyse the structural integrity of dicing blade in terms of tool wear, surface roughness, microstructu...

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Main Authors: S.K., Lim, M. F., Zamri, Ahmad Razlan, Yusoff
Format: Article
Language:English
Published: Elsevier 2022
Subjects:
Online Access:http://umpir.ump.edu.my/id/eprint/36666/
http://umpir.ump.edu.my/id/eprint/36666/1/LIM%20SYH%20KAI.pdf
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author S.K., Lim
M. F., Zamri
Ahmad Razlan, Yusoff
author_facet S.K., Lim
M. F., Zamri
Ahmad Razlan, Yusoff
author_sort S.K., Lim
building UMP Institutional Repository
collection Online Access
description Dicing operation in cutting hard-brittle ceramic die using nickel–diamond blade causes cracked or chipped die, accelerated tool wear and, ultimately, shortage of blade lifetime. This study aims to analyse the structural integrity of dicing blade in terms of tool wear, surface roughness, microstructure and elements during dicing. The measurements of wear blade on the blade are made by confocal microscope, whereas surface and elemental analyses are carried out with EDX SEM. Results show that the volumetric wear rate of blade is 20%, similar to roughness. The microstructure of the blade changes with occurrence of Aluminium owing to abrasive wear mechanism during cutting.
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publisher Elsevier
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spelling ump-366662023-01-10T04:57:42Z http://umpir.ump.edu.my/id/eprint/36666/ Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die S.K., Lim M. F., Zamri Ahmad Razlan, Yusoff T Technology (General) TA Engineering (General). Civil engineering (General) TS Manufactures Dicing operation in cutting hard-brittle ceramic die using nickel–diamond blade causes cracked or chipped die, accelerated tool wear and, ultimately, shortage of blade lifetime. This study aims to analyse the structural integrity of dicing blade in terms of tool wear, surface roughness, microstructure and elements during dicing. The measurements of wear blade on the blade are made by confocal microscope, whereas surface and elemental analyses are carried out with EDX SEM. Results show that the volumetric wear rate of blade is 20%, similar to roughness. The microstructure of the blade changes with occurrence of Aluminium owing to abrasive wear mechanism during cutting. Elsevier 2022-06-01 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/36666/1/LIM%20SYH%20KAI.pdf S.K., Lim and M. F., Zamri and Ahmad Razlan, Yusoff (2022) Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die. Procedia CIRP, 108. pp. 465-469. ISSN 2212-8271 (Online). (Published) https://doi.org/10.1016/j.procir.2022.03.073 https://doi.org/10.1016/j.procir.2022.03.073
spellingShingle T Technology (General)
TA Engineering (General). Civil engineering (General)
TS Manufactures
S.K., Lim
M. F., Zamri
Ahmad Razlan, Yusoff
Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_full Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_fullStr Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_full_unstemmed Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_short Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_sort structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
topic T Technology (General)
TA Engineering (General). Civil engineering (General)
TS Manufactures
url http://umpir.ump.edu.my/id/eprint/36666/
http://umpir.ump.edu.my/id/eprint/36666/
http://umpir.ump.edu.my/id/eprint/36666/
http://umpir.ump.edu.my/id/eprint/36666/1/LIM%20SYH%20KAI.pdf