Study of underfill flow in microchip packaging using ansys
The project was related to microchip application where adhesive fluid is used to stick the microchip onto the electrical flat base. In this project, 5mm of width and length of microchip with 3 different types of solder ball diameter sizes are used in this project. The objective of the project is to...
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| Format: | Article |
| Language: | English |
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Penerbit UMP
2022
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| Online Access: | http://umpir.ump.edu.my/id/eprint/35701/ http://umpir.ump.edu.my/id/eprint/35701/1/Study%20of%20Underfill%20Flow%20in%20Microchip%20PackagingUsing%20Ansys.pdf |
| _version_ | 1848824848255549440 |
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| author | Hussin, N.F.R. Rosli, N. |
| author_facet | Hussin, N.F.R. Rosli, N. |
| author_sort | Hussin, N.F.R. |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | The project was related to microchip application where adhesive fluid is used to stick the microchip onto the electrical flat base. In this project, 5mm of width and length of microchip with 3 different types of solder ball diameter sizes are used in this project. The objective of the project is to study the flow pattern and velocity of fluid during injection based on the decided parameters, which are initial velocity, fluid viscosity, and the diameter of the solder ball. Each parameter that has been set produces a different outcome in terms of flow pattern and velocity of fluid. To maximise the performance of fluid flow in the aspect of uniformity of the fluid flow to fill the gap around the solder ball, the flow pattern and the velocity are being observed and recorded throughout the simulation process. |
| first_indexed | 2025-11-15T03:19:33Z |
| format | Article |
| id | ump-35701 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T03:19:33Z |
| publishDate | 2022 |
| publisher | Penerbit UMP |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-357012022-11-16T07:29:53Z http://umpir.ump.edu.my/id/eprint/35701/ Study of underfill flow in microchip packaging using ansys Hussin, N.F.R. Rosli, N. T Technology (General) TK Electrical engineering. Electronics Nuclear engineering TS Manufactures The project was related to microchip application where adhesive fluid is used to stick the microchip onto the electrical flat base. In this project, 5mm of width and length of microchip with 3 different types of solder ball diameter sizes are used in this project. The objective of the project is to study the flow pattern and velocity of fluid during injection based on the decided parameters, which are initial velocity, fluid viscosity, and the diameter of the solder ball. Each parameter that has been set produces a different outcome in terms of flow pattern and velocity of fluid. To maximise the performance of fluid flow in the aspect of uniformity of the fluid flow to fill the gap around the solder ball, the flow pattern and the velocity are being observed and recorded throughout the simulation process. Penerbit UMP 2022-09 Article PeerReviewed pdf en cc_by_4 http://umpir.ump.edu.my/id/eprint/35701/1/Study%20of%20Underfill%20Flow%20in%20Microchip%20PackagingUsing%20Ansys.pdf Hussin, N.F.R. and Rosli, N. (2022) Study of underfill flow in microchip packaging using ansys. Journal of Modern Manufacturing Systems and Technology (JMMST), 6 (2). pp. 76-82. ISSN 2636-9575. (Published) https://doi.org/10.15282/jmmst.v6i2.8571 https://doi.org/10.15282/jmmst.v6i2.8571 |
| spellingShingle | T Technology (General) TK Electrical engineering. Electronics Nuclear engineering TS Manufactures Hussin, N.F.R. Rosli, N. Study of underfill flow in microchip packaging using ansys |
| title | Study of underfill flow in microchip packaging using ansys |
| title_full | Study of underfill flow in microchip packaging using ansys |
| title_fullStr | Study of underfill flow in microchip packaging using ansys |
| title_full_unstemmed | Study of underfill flow in microchip packaging using ansys |
| title_short | Study of underfill flow in microchip packaging using ansys |
| title_sort | study of underfill flow in microchip packaging using ansys |
| topic | T Technology (General) TK Electrical engineering. Electronics Nuclear engineering TS Manufactures |
| url | http://umpir.ump.edu.my/id/eprint/35701/ http://umpir.ump.edu.my/id/eprint/35701/ http://umpir.ump.edu.my/id/eprint/35701/ http://umpir.ump.edu.my/id/eprint/35701/1/Study%20of%20Underfill%20Flow%20in%20Microchip%20PackagingUsing%20Ansys.pdf |