Hussin, N., & Rosli, N. (2022). Study of underfill flow in microchip packaging using ansys. Penerbit UMP.
Chicago Style (17th ed.) CitationHussin, N.F.R, and N. Rosli. Study of Underfill Flow in Microchip Packaging Using Ansys. Penerbit UMP, 2022.
MLA (9th ed.) CitationHussin, N.F.R, and N. Rosli. Study of Underfill Flow in Microchip Packaging Using Ansys. Penerbit UMP, 2022.
Warning: These citations may not always be 100% accurate.