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Effect of Reflow Profile on Intermetallic Compound Formation

Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So f...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Format:	Article
Language:	English English
Published:	IOP Publishing 2013
Subjects:	TS Manufactures
Online Access:	http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf

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