Effect of Reflow Profile on Intermetallic Compound Formation
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So f...
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| Language: | English English |
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IOP Publishing
2013
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| Online Access: | http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf |
| _version_ | 1848817253878857728 |
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| author | Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman |
| author_facet | Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman |
| author_sort | Siti Rabiatull Aisha, Idris |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes on the reliability of lead-free solder joints. While the effects of reflow conditions on intermetallic compound (IMC) formation at the solder joint such as the atmosphere during the reflow process are still unclear. The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth. Several techniques of materials characterization including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis will be used to characterise the intermetallics in terms of composition, thickness and morphology. In addition, the effects of cooling rate and isothermal aging were also studied for the solder alloy Sn–4Ag–0.5Cu on electroless nickel/immersion gold (ENIG) surface finish. From the study, it was found that reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have a significant effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal aging. |
| first_indexed | 2025-11-15T01:18:50Z |
| format | Article |
| id | ump-3549 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-15T01:18:50Z |
| publishDate | 2013 |
| publisher | IOP Publishing |
| recordtype | eprints |
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| spelling | ump-35492018-01-15T08:08:51Z http://umpir.ump.edu.my/id/eprint/3549/ Effect of Reflow Profile on Intermetallic Compound Formation Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman TS Manufactures Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes on the reliability of lead-free solder joints. While the effects of reflow conditions on intermetallic compound (IMC) formation at the solder joint such as the atmosphere during the reflow process are still unclear. The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth. Several techniques of materials characterization including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis will be used to characterise the intermetallics in terms of composition, thickness and morphology. In addition, the effects of cooling rate and isothermal aging were also studied for the solder alloy Sn–4Ag–0.5Cu on electroless nickel/immersion gold (ENIG) surface finish. From the study, it was found that reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have a significant effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal aging. IOP Publishing 2013 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Azmah Hanim, Mohamad Ariff and Saliza Azlina, Osman (2013) Effect of Reflow Profile on Intermetallic Compound Formation. IOP Conference Series: Materials Science and Engineering, 46. pp. 1-8. ISSN 1757-8981 (Print), 1757-899X (Online). (Published) http://dx.doi.org/10.1016/j.clnme.2012.05.002 DOI: 10.1016/j.clnme.2012.05.002 |
| spellingShingle | TS Manufactures Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman Effect of Reflow Profile on Intermetallic Compound Formation |
| title | Effect of Reflow Profile on Intermetallic Compound Formation |
| title_full | Effect of Reflow Profile on Intermetallic Compound Formation |
| title_fullStr | Effect of Reflow Profile on Intermetallic Compound Formation |
| title_full_unstemmed | Effect of Reflow Profile on Intermetallic Compound Formation |
| title_short | Effect of Reflow Profile on Intermetallic Compound Formation |
| title_sort | effect of reflow profile on intermetallic compound formation |
| topic | TS Manufactures |
| url | http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf |