Investigation of optimum EDM die sinking parameters in micro dimple machining

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Investigation of optimum EDM die sinking parameters in micro dimple machining

Micro dimple is a standard surface structure that is commonly used in micro-moulds, micro/nano-fluid devices, micromechanical systems, and bionic functional surfaces. These microstructure surfaces can be used for optical communication systems, micro sensors, flat panel display, light emitting diode...

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Bibliographic Details
Main Authors:	Lee, Jie Ying, Ahmad Rosli, Abdul Manaf
Format:	Article
Language:	English
Published:	Penerbit UMP 2022
Subjects:	TJ Mechanical engineering and machinery TS Manufactures
Online Access:	http://umpir.ump.edu.my/id/eprint/34129/ http://umpir.ump.edu.my/id/eprint/34129/1/Investigation%20of%20optimum%20EDM%20die%20sinking%20parameters.pdf

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