Microwave hybrid heating as an alternative method for soldering—A brief review
The paper reviews the Microwave Hybrid Heating (MHH) method as well as the effect of MHH towards the interfacial reaction and the shear strength at the solder/Cu joint. Previously, reflow soldering process was performed to solder electronic component. Due to its high defect rate, processing time and...
| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Language: | English English |
| Published: |
Springer
2023
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/33292/ http://umpir.ump.edu.my/id/eprint/33292/1/Microwave%20Hybrid%20Heating%20As%20An%20Alternative1.pdf http://umpir.ump.edu.my/id/eprint/33292/2/Microwave%20Hybrid%20Heating%20As%20An%20Alternative.pdf |
| _version_ | 1848824219518894080 |
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| author | N. M., Maliessa S. R. A., Idris |
| author_facet | N. M., Maliessa S. R. A., Idris |
| author_sort | N. M., Maliessa |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | The paper reviews the Microwave Hybrid Heating (MHH) method as well as the effect of MHH towards the interfacial reaction and the shear strength at the solder/Cu joint. Previously, reflow soldering process was performed to solder electronic component. Due to its high defect rate, processing time and energy consumption, MHH method are getting more attention among electronics manufacturers to perform industrial process as it is beneficial in modern microtechnology. MHH method has faster heating rate, improve heating uniformity, reduces the chance of thermal runaway, reduce processing temperature, and reduce hazards to human and environment. This approach has proven to yield scallop-like and angular trapezoid structure of Cu6Sn5 and Cu3Sn in the intermetallic compound (IMC). The IMC thickness shows a competitive result (5.337μm and 5.717μm) compared to reflow soldering. However, not many studies were done on the shear strength of the solder joint. |
| first_indexed | 2025-11-15T03:09:33Z |
| format | Conference or Workshop Item |
| id | ump-33292 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-15T03:09:33Z |
| publishDate | 2023 |
| publisher | Springer |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-332922023-11-10T03:18:10Z http://umpir.ump.edu.my/id/eprint/33292/ Microwave hybrid heating as an alternative method for soldering—A brief review N. M., Maliessa S. R. A., Idris TS Manufactures The paper reviews the Microwave Hybrid Heating (MHH) method as well as the effect of MHH towards the interfacial reaction and the shear strength at the solder/Cu joint. Previously, reflow soldering process was performed to solder electronic component. Due to its high defect rate, processing time and energy consumption, MHH method are getting more attention among electronics manufacturers to perform industrial process as it is beneficial in modern microtechnology. MHH method has faster heating rate, improve heating uniformity, reduces the chance of thermal runaway, reduce processing temperature, and reduce hazards to human and environment. This approach has proven to yield scallop-like and angular trapezoid structure of Cu6Sn5 and Cu3Sn in the intermetallic compound (IMC). The IMC thickness shows a competitive result (5.337μm and 5.717μm) compared to reflow soldering. However, not many studies were done on the shear strength of the solder joint. Springer 2023 Conference or Workshop Item PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/33292/1/Microwave%20Hybrid%20Heating%20As%20An%20Alternative1.pdf pdf en http://umpir.ump.edu.my/id/eprint/33292/2/Microwave%20Hybrid%20Heating%20As%20An%20Alternative.pdf N. M., Maliessa and S. R. A., Idris (2023) Microwave hybrid heating as an alternative method for soldering—A brief review. In: Lecture Notes in Mechanical Engineering; 6th International Conference in Mechanical Engineering Research, ICMER 2021 , 26 - 27 October 2021 , Virtual, Online. pp. 565-577.. ISSN 2195-4356 ISBN 978-981191456-0 (Published) https://doi.org/10.1007/978-981-19-1457-7_44 |
| spellingShingle | TS Manufactures N. M., Maliessa S. R. A., Idris Microwave hybrid heating as an alternative method for soldering—A brief review |
| title | Microwave hybrid heating as an alternative method for soldering—A brief review |
| title_full | Microwave hybrid heating as an alternative method for soldering—A brief review |
| title_fullStr | Microwave hybrid heating as an alternative method for soldering—A brief review |
| title_full_unstemmed | Microwave hybrid heating as an alternative method for soldering—A brief review |
| title_short | Microwave hybrid heating as an alternative method for soldering—A brief review |
| title_sort | microwave hybrid heating as an alternative method for soldering—a brief review |
| topic | TS Manufactures |
| url | http://umpir.ump.edu.my/id/eprint/33292/ http://umpir.ump.edu.my/id/eprint/33292/ http://umpir.ump.edu.my/id/eprint/33292/1/Microwave%20Hybrid%20Heating%20As%20An%20Alternative1.pdf http://umpir.ump.edu.my/id/eprint/33292/2/Microwave%20Hybrid%20Heating%20As%20An%20Alternative.pdf |