Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review

QR Code

Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review

Nowadays the application of laser technology in microelectronic packaging has been widely implemented in many developed countries. Its flexibility on setting the parameters by following individual’s requirement, localized heating, non-contact heating, fast heating and cooling rate makes it one of th...

Full description

Bibliographic Details
Main Authors:	Nabila, Tamar Jaya, Siti Rabiatull Aisha, Idris
Format:	Conference or Workshop Item
Language:	English English
Published:	Universiti Malaysia Pahang 2019
Subjects:	TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://umpir.ump.edu.my/id/eprint/27993/ http://umpir.ump.edu.my/id/eprint/27993/1/25.%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf http://umpir.ump.edu.my/id/eprint/27993/2/25.1%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf

Similar Items

The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2022)

Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
by: Nabila, Tamar Jaya
Published: (2024)

Optimization On Laser Soldering Parameters Onto Lead-Free Solder Joint
by: T. J., Nabila, et al.
Published: (2017)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)

Effect of Reflow Soldering Profile on Intermetallic Compound Formation
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)

A review on mechanical properties of SnAgCu/Cu joint using laser soldering
by: Nabila, Tamar Jaya, et al.
Published: (2018)

Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth
by: Muhammad Asyraf, Abdullah, et al.
Published: (2021)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)

Damage mechanics model for solder/intermetallics interface fracture process in solder joints
by: Shaffiar, Norhashimah, et al.
Published: (2011)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2018)

Effect of Flux onto Intermetallic Compound Formation and Growth
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)

Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
by: Wahab, Abdul Karim Abdul
Published: (2011)

A review: effect of copper percentage solder alloy after laser soldering
by: Asyraf, Abdullah, et al.
Published: (2023)

Microstructure Evolution at the Solder Joint During Isothermal Aging
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)

Effect of Immersion Coating Deposition Time on Solder Joint Properties
by: Zetty Akhtar, Abd Malek, et al.
Published: (2016)

Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
by: Leong, Kum Foo
Published: (2003)

A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
by: Hardinnawirda, Kahar, et al.
Published: (2017)

Effect Of Indium On Microstructure And Intermetallic Compound Formation During Isothermal Aging Of Sncu Solder Alloy
by: Khusaini, Nur Nadirah Mohd
Published: (2018)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)

Thermomigration in lead-free solder joints
by: Abdul Hamid, M. F, et al.
Published: (2008)

Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017)

The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish
by: Jaidi, Zolhafizi
Published: (2020)

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)

Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2014)

A Review on Effect of Nickel Doping on Solder Joint Reliability
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024)

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)

Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)

The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)

Solder Joint Reliability Of Flip Chip BGA Package
by: Lee, Kor Oon
Published: (2004)

Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
by: Chung, Chee Key
Published: (2003)

Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
by: Roduan, Siti Faqihah, et al.
Published: (2019)

Intermetallic growth of SAC237 solder paste reinforced with MWCNT
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2017)

Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
by: Hardinnawirda, Kahar
Published: (2017)

Optimization Of Laser Soldering Parameters On Passive Devices
by: Ahmad Nadzri, Faiz Farhan
Published: (2022)

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)

Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
by: Ariff Syakirin, Ghazalli
Published: (2007)

Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
by: Ghani, Fitriah Abdul
Published: (2018)