A review on mechanical properties of SnAgCu/Cu joint using laser soldering

A review on mechanical properties of SnAgCu/Cu joint using laser soldering

This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects to...

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Bibliographic Details
Main Authors: Nabila, Tamar Jaya, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Book Chapter
Language:English
English
Published: Springer, Singapore 2018
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/24641/
http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf
http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf

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