Analysis of liquid film flow in between two different plates

Analysis of liquid film flow in between two different plates

In flip chip technology, analysis of underfill flow between chip and substrate are important to prevent the chip from breaking. In other words, the welded solder balls in the packaged chip, underfill epoxy is filled into the gap between a chip and a substrate. It is because to prevent cracks on the...

Full description

Bibliographic Details
Main Author: Wan Mohd Hasrol, Wan Hasan
Format: Undergraduates Project Papers
Language:English
Published: 2016
Subjects:
Q Science (General)
TS Manufactures
Online Access:http://umpir.ump.edu.my/id/eprint/16241/
http://umpir.ump.edu.my/id/eprint/16241/1/09.Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates.pdf

Similar Items

Similar Items