The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation

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The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation

The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface f...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Saliza Azlina, Osman
Format:	Article
Language:	English
Published:	World Academy of Science, Engineering and Technology 2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf

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