The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface f...
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| Format: | Article |
| Language: | English |
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World Academy of Science, Engineering and Technology
2016
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| Online Access: | http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf |
| _version_ | 1848820048083288064 |
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| author | Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman |
| author_facet | Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman |
| author_sort | Siti Rabiatull Aisha, Idris |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni3Sn4 and Ni3Sn2 were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined. |
| first_indexed | 2025-11-15T02:03:15Z |
| format | Article |
| id | ump-15813 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T02:03:15Z |
| publishDate | 2016 |
| publisher | World Academy of Science, Engineering and Technology |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-158132018-01-15T07:34:29Z http://umpir.ump.edu.my/id/eprint/15813/ The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman TJ Mechanical engineering and machinery The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni3Sn4 and Ni3Sn2 were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined. World Academy of Science, Engineering and Technology 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Saliza Azlina, Osman (2016) The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation. International Journal of Chemical, Molecular, Nuclear, Materials and Metallurgical Engineering, 10 (1). pp. 107-111. ISSN 1307-6892. (Published) http://waset.org/Publication/the-effectiveness-of-bismuth-addition-to-retard-the-intermetallic-compound-formation/10004675 |
| spellingShingle | TJ Mechanical engineering and machinery Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation |
| title | The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation |
| title_full | The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation |
| title_fullStr | The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation |
| title_full_unstemmed | The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation |
| title_short | The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation |
| title_sort | effectiveness of bismuth addition to retard the intermetallic compound formation |
| topic | TJ Mechanical engineering and machinery |
| url | http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf |