Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish

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Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish

The formation and growth of the intermetallic were frequently discussed since lead-free solder took place replacing the lead solder. However, the effect of multiple reflow process on the intermetallic morphology that was subjected to aging still needs further investigation. Thus, this study aimed to...

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Bibliographic Details
Main Authors:	Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2016
Subjects:	T Technology (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/15210/ http://umpir.ump.edu.my/id/eprint/15210/1/kahar2016-1.pdf

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