Finite Element Prediction of Heat-Affected Zone in Laser-micromachining of Silicon

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Finite Element Prediction of Heat-Affected Zone in Laser-micromachining of Silicon

Silicon has been a major material used for fabricating MEMS devices that are now potentially a far more pervasive technology. In processing of silicon material, laser-micromachining has been increasingly employed. However, laser debris and thermal crack are problematic with laser machining and also...

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Bibliographic Details
Main Authors:	T. T., Mon, M. M., Noor, R. A., Bakar, M. R. M., Rejab
Format:	Conference or Workshop Item
Language:	English
Published:	2008
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/1475/ http://umpir.ump.edu.my/id/eprint/1475/1/Finite_Element_Prediction_of_Heat-Affected_Zone_in_Laser-micromachining_of.pdf

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