Effect of Flux onto Intermetallic Compound Formation and Growth

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Effect of Flux onto Intermetallic Compound Formation and Growth

In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Noor, Farihan, Hardinnawirda, Kahar
Format:	Conference or Workshop Item
Language:	English
Published:	EDP Sciences 2016
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/14487/ http://umpir.ump.edu.my/id/eprint/14487/6/fkm-2016-aisha-effect%20of%20flux.pdf

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