Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow

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Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow

Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluat...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Siti, Zuleikha, Zetty Akhtar, Abd Malek
Format:	Conference or Workshop Item
Language:	English English
Published:	EDP Sciences 2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf

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