Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluat...
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| Format: | Conference or Workshop Item |
| Language: | English English |
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EDP Sciences
2016
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| Online Access: | http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf |
| _version_ | 1848819712201326592 |
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| author | Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek |
| author_facet | Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek |
| author_sort | Siti Rabiatull Aisha, Idris |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC) found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength. |
| first_indexed | 2025-11-15T01:57:55Z |
| format | Conference or Workshop Item |
| id | ump-14390 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-15T01:57:55Z |
| publishDate | 2016 |
| publisher | EDP Sciences |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-143902018-01-15T07:36:54Z http://umpir.ump.edu.my/id/eprint/14390/ Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek TJ Mechanical engineering and machinery Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC) found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength. EDP Sciences 2016 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf application/pdf en cc_by http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf Siti Rabiatull Aisha, Idris and Siti, Zuleikha and Zetty Akhtar, Abd Malek (2016) Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow. In: MATEC Web of Conferences: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015) , 18-19 August 2015 , Zenith Hotel, Kuantan, Pahang, Malaysia. pp. 1-5., 74 (00038). ISSN 2261-236X (Published) http://dx.doi.org/10.1051/matecconf/20167400038 |
| spellingShingle | TJ Mechanical engineering and machinery Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow |
| title | Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow |
| title_full | Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow |
| title_fullStr | Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow |
| title_full_unstemmed | Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow |
| title_short | Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow |
| title_sort | wettability study of lead free solder paste and its effect towards multiple reflow |
| topic | TJ Mechanical engineering and machinery |
| url | http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf |