Experimental laser-machining of silicon wafer

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Experimental laser-machining of silicon wafer

This thesis deals with laser machining of silicon wafer at various process parameters. The objective of this thesis is to investigate the effect of laser machining parameters on the cut surface quality and determine the feasible laser machining parameters that can machine silicon wafer. The thesis d...

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Bibliographic Details
Main Author:	Lau, Zhen Chyen
Format:	Undergraduates Project Papers
Language:	English
Published:	2010
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/1417/ http://umpir.ump.edu.my/id/eprint/1417/1/Lau%2C_Zhen_Chyen_%28_CD_5022_%29.pdf

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