A Review: Lead Free Solder and Its Wettability Properties

A Review: Lead Free Solder and Its Wettability Properties

The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder char...

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Bibliographic Details
Main Authors: Ervina Efzan, Ervina Efzan, Nur Faziera, Mhd Nasir, Siti Rabiatull Aisha, Idris
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2016
Subjects:
Not Available
Online Access:http://umpir.ump.edu.my/id/eprint/13901/
http://umpir.ump.edu.my/id/eprint/13901/1/fkm-2016-aisha-Review%20lead%20free.pdf

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