Intermetallic Growth and Shear Strength of SAC305/EN-Boron

Intermetallic Growth and Shear Strength of SAC305/EN-Boron

The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area.EN-Boron was plated on Cu substrate through electroless plating method. This process was followed by ref...

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Bibliographic Details
Main Authors: Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Article
Language:English
English
Published: Emerald Group Publishing Limited 2016
Subjects:
Not Available
Online Access:http://umpir.ump.edu.my/id/eprint/13899/
http://umpir.ump.edu.my/id/eprint/13899/1/Intermetallic%20growth%20and%20shear%20strength%20of%20%20SAC305EN-Boron_wirda.pdf
http://umpir.ump.edu.my/id/eprint/13899/7/fkm-2016-aisha-Intermetallic%20growth%20and%20shear%20strength1.pdf

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