Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend
In the present work, palm oil based alkyd resin was prepared with and without the presence of CuO nanoparticles. The curing of the prepared alkyd resin with different ratio of epoxy resin in the presence of poly(amido amine) as hardener was investigated. The mechanical properties, such as tensile an...
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| Format: | Article |
| Language: | English English |
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Elsevier
2015
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| Online Access: | http://umpir.ump.edu.my/id/eprint/12591/ http://umpir.ump.edu.my/id/eprint/12591/1/Effect%20of%20CuO%20Nanoparticle%20on%20Mechanical%20and%20Thermal%20Properties%20of%20Palm%20Oil%20Based%20Alkyd-Epoxy%20Resin%20Blend.pdf http://umpir.ump.edu.my/id/eprint/12591/7/Effect%20of%20CuO%20Nanoparticle%20on%20Mechanical%20and%20Thermal%20Properties%20of%20Palm%20Oil%20based%20Alkyd.pdf |
| _version_ | 1848819275791335424 |
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| author | Ong, Huei Ruey Khan, Maksudur R. Ridzuan, Ramli R. M., Yunus |
| author_facet | Ong, Huei Ruey Khan, Maksudur R. Ridzuan, Ramli R. M., Yunus |
| author_sort | Ong, Huei Ruey |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | In the present work, palm oil based alkyd resin was prepared with and without the presence of CuO nanoparticles. The curing of the prepared alkyd resin with different ratio of epoxy resin in the presence of poly(amido amine) as hardener was investigated. The mechanical properties, such as tensile and flexural strength of the cured blends were measured. The interaction between alkyd, epoxy and CuO nanoparticle were investigated by using Fourier transform infrared spectroscopy (FTIR). It was found that, crosslinking between alkyd and epoxy is possible through the formation of interpenetrating polymer network (IPN). The thermal stability and wettability of the blend was also investigated. It was found that, the CuO incorporated nanocomposite presented greater thermal stability and hydrophobicity than neat composite. |
| first_indexed | 2025-11-15T01:50:58Z |
| format | Article |
| id | ump-12591 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-15T01:50:58Z |
| publishDate | 2015 |
| publisher | Elsevier |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-125912018-01-15T01:55:53Z http://umpir.ump.edu.my/id/eprint/12591/ Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend Ong, Huei Ruey Khan, Maksudur R. Ridzuan, Ramli R. M., Yunus TP Chemical technology In the present work, palm oil based alkyd resin was prepared with and without the presence of CuO nanoparticles. The curing of the prepared alkyd resin with different ratio of epoxy resin in the presence of poly(amido amine) as hardener was investigated. The mechanical properties, such as tensile and flexural strength of the cured blends were measured. The interaction between alkyd, epoxy and CuO nanoparticle were investigated by using Fourier transform infrared spectroscopy (FTIR). It was found that, crosslinking between alkyd and epoxy is possible through the formation of interpenetrating polymer network (IPN). The thermal stability and wettability of the blend was also investigated. It was found that, the CuO incorporated nanocomposite presented greater thermal stability and hydrophobicity than neat composite. Elsevier 2015 Article PeerReviewed application/pdf en cc_by_nc_nd http://umpir.ump.edu.my/id/eprint/12591/1/Effect%20of%20CuO%20Nanoparticle%20on%20Mechanical%20and%20Thermal%20Properties%20of%20Palm%20Oil%20Based%20Alkyd-Epoxy%20Resin%20Blend.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/12591/7/Effect%20of%20CuO%20Nanoparticle%20on%20Mechanical%20and%20Thermal%20Properties%20of%20Palm%20Oil%20based%20Alkyd.pdf Ong, Huei Ruey and Khan, Maksudur R. and Ridzuan, Ramli and R. M., Yunus (2015) Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend. Procedia Chemistry, 16. pp. 623-631. ISSN 18766196. (Published) http://dx.doi.org/10.1016/j.proche.2015.12.101 doi:10.1016/j.proche.2015.12.101 |
| spellingShingle | TP Chemical technology Ong, Huei Ruey Khan, Maksudur R. Ridzuan, Ramli R. M., Yunus Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend |
| title | Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend |
| title_full | Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend |
| title_fullStr | Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend |
| title_full_unstemmed | Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend |
| title_short | Effect of CuO Nanoparticle on Mechanical and Thermal Properties of Palm Oil Based Alkyd/Epoxy Resin Blend |
| title_sort | effect of cuo nanoparticle on mechanical and thermal properties of palm oil based alkyd/epoxy resin blend |
| topic | TP Chemical technology |
| url | http://umpir.ump.edu.my/id/eprint/12591/ http://umpir.ump.edu.my/id/eprint/12591/ http://umpir.ump.edu.my/id/eprint/12591/ http://umpir.ump.edu.my/id/eprint/12591/1/Effect%20of%20CuO%20Nanoparticle%20on%20Mechanical%20and%20Thermal%20Properties%20of%20Palm%20Oil%20Based%20Alkyd-Epoxy%20Resin%20Blend.pdf http://umpir.ump.edu.my/id/eprint/12591/7/Effect%20of%20CuO%20Nanoparticle%20on%20Mechanical%20and%20Thermal%20Properties%20of%20Palm%20Oil%20based%20Alkyd.pdf |