Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography
In ultraviolet nanoimprint lithography (UV-NIL), the presence of fluorinated components in a release-agent-free antireflection-structured (RAF-ARS) replica mold is an important factor preventing the adhesion of resin on its surface. Nevertheless, a strong release force (RF), which results from the c...
| Main Authors: | , , , |
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| Format: | Article |
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IOP Publishing
2015
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| Online Access: | http://umpir.ump.edu.my/id/eprint/11884/ |
| _version_ | 1848819098324041728 |
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| author | Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin |
| author_facet | Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin |
| author_sort | Nurhafizah, Abu Talip |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | In ultraviolet nanoimprint lithography (UV-NIL), the presence of fluorinated components in a release-agent-free antireflection-structured (RAF-ARS) replica mold is an important factor preventing the adhesion of resin on its surface. Nevertheless, a strong release force (RF), which results from the complete filling of resin in a high-aspect-ratio RAF-ARS replica mold during UV-NIL, degrades its fluorinated components and consequently shortens its lifetime. In this paper, we propose a technique for the lifetime amelioration of RAF-ARS replica molds by partial-filling UV-NIL. Complete-filling UV-NIL was also executed for comparison. We also examined the effects of the filling ratio on an RAF-ARS replica mold. Using the partial-filling UV-NIL technique, we successfully prolonged the lifetime of an RAF-ARS replica mold up to the 100th imprint, compared with the 75th imprint in the case of complete-filling UV-NIL. |
| first_indexed | 2025-11-15T01:48:09Z |
| format | Article |
| id | ump-11884 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| last_indexed | 2025-11-15T01:48:09Z |
| publishDate | 2015 |
| publisher | IOP Publishing |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-118842018-06-28T01:07:55Z http://umpir.ump.edu.my/id/eprint/11884/ Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin TK Electrical engineering. Electronics Nuclear engineering In ultraviolet nanoimprint lithography (UV-NIL), the presence of fluorinated components in a release-agent-free antireflection-structured (RAF-ARS) replica mold is an important factor preventing the adhesion of resin on its surface. Nevertheless, a strong release force (RF), which results from the complete filling of resin in a high-aspect-ratio RAF-ARS replica mold during UV-NIL, degrades its fluorinated components and consequently shortens its lifetime. In this paper, we propose a technique for the lifetime amelioration of RAF-ARS replica molds by partial-filling UV-NIL. Complete-filling UV-NIL was also executed for comparison. We also examined the effects of the filling ratio on an RAF-ARS replica mold. Using the partial-filling UV-NIL technique, we successfully prolonged the lifetime of an RAF-ARS replica mold up to the 100th imprint, compared with the 75th imprint in the case of complete-filling UV-NIL. IOP Publishing 2015 Article PeerReviewed Nurhafizah, Abu Talip and Hayashi, Tatsuya and Taniguchi, Jun and Hiwasa, Shin (2015) Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography. Japanese Journal of Applied Physics, 54 (6S1). pp. 1-7. ISSN 0021-4922. (Published) http://dx.doi.org/10.7567/JJAP.54.06FM04 DOI: 10.7567/JJAP.54.06FM04 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Nurhafizah, Abu Talip Hayashi, Tatsuya Taniguchi, Jun Hiwasa, Shin Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography |
| title | Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography
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| title_full | Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography
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| title_fullStr | Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography
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| title_full_unstemmed | Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography
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| title_short | Lifetime Amelioration of Release-Agent-Free Antireflection-Structured Replica Molds by Partial-Filling Ultraviolet Nanoimprint Lithography
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| title_sort | lifetime amelioration of release-agent-free antireflection-structured replica molds by partial-filling ultraviolet nanoimprint lithography |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://umpir.ump.edu.my/id/eprint/11884/ http://umpir.ump.edu.my/id/eprint/11884/ http://umpir.ump.edu.my/id/eprint/11884/ |