Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English English |
| Published: |
Wessex Institute of Technology
2015
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/11846/ http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf |
| _version_ | 1848819090322358272 |
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| author | Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman |
| author_facet | Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman |
| author_sort | Siti Rabiatull Aisha, Idris |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy
and copper-printed circuit board was developed. The electroless plating technique was used to develop
Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt% (low),
5–8 wt% (medium) and above 8 wt% (high). The results reveal that the high phosphorus content in
nickel layer acts as a good diffusion barrier for Sn–4Ag–0.5Cu since it can suppress the intermetallic
compound formation. This is because in higher phosphorus content, the grain boundaries were found to
be eliminated. Hence, resulted in thinner intermetallic compound thickness. |
| first_indexed | 2025-11-15T01:48:02Z |
| format | Article |
| id | ump-11846 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-15T01:48:02Z |
| publishDate | 2015 |
| publisher | Wessex Institute of Technology |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-118462018-01-15T07:44:11Z http://umpir.ump.edu.my/id/eprint/11846/ Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman TA Engineering (General). Civil engineering (General) TN Mining engineering. Metallurgy In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt% (low), 5–8 wt% (medium) and above 8 wt% (high). The results reveal that the high phosphorus content in nickel layer acts as a good diffusion barrier for Sn–4Ag–0.5Cu since it can suppress the intermetallic compound formation. This is because in higher phosphorus content, the grain boundaries were found to be eliminated. Hence, resulted in thinner intermetallic compound thickness. Wessex Institute of Technology 2015 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Azmah Hanim, Mohamad Ariff and Saliza Azlina, Osman (2015) Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method. International Journal of Computational Methods and Experimental Measurements, 3 (4). pp. 329-339. ISSN 2046-0546 (print); 2046-0554 (online). (Published) http://www.witpress.com/elibrary/cmem-volumes/3/4/1056 DOI: 10.2495/CMEM-V3-N4-329-339 |
| spellingShingle | TA Engineering (General). Civil engineering (General) TN Mining engineering. Metallurgy Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method |
| title | Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method |
| title_full | Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method |
| title_fullStr | Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method |
| title_full_unstemmed | Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method |
| title_short | Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method |
| title_sort | development of diffusion barrier layer on copper-printed circuit board using electroless plating method |
| topic | TA Engineering (General). Civil engineering (General) TN Mining engineering. Metallurgy |
| url | http://umpir.ump.edu.my/id/eprint/11846/ http://umpir.ump.edu.my/id/eprint/11846/ http://umpir.ump.edu.my/id/eprint/11846/ http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf |