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Effect of Reflow Soldering Profile on Intermetallic Compound Formation

Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation a...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Format:	Article
Language:	English English
Published:	Inderscience 2015
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf

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