Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping

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Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping

High temperature die attach material has excellent corrosion resistance, good ductility, good electrical volume resistivity. Therefore, die attach materials have been introduced for electronic packaging. Nanoparticles have high surface energies and was developed for the use at high operational tempe...

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Bibliographic Details
Main Author:	Shiu , Kai Ping
Format:	Thesis
Published:	2017
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/8570/ http://studentsrepo.um.edu.my/8570/5/Research_report_Shiu_Kai_Ping.pdf

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