Performance evaluation of copper brazing using CU-NI-SN-P filler metal / Mohd Zubir Md Idris

QR Code

Performance evaluation of copper brazing using CU-NI-SN-P filler metal / Mohd Zubir Md Idris

Joining pure copper by brazing techniques using electric heated tube furnace has been done to brazed copper for heat exchanger application. Brazing temperatures specify within range of 660 °C to 700 °C using two different commercial alloy metals Cu-Sn-P base, VZ2200 and MBF2005. The filler metals we...

Full description

Bibliographic Details
Main Author:	Mohd Zubir, Md Idris
Format:	Thesis
Published:	2017
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/8494/ http://studentsrepo.um.edu.my/8494/4/PERFORMANCE_EVALUATION_OF_COPPER_BRAZING_USING_CU%2DNI%2DSN%2DP_FILLER_METAL.pdf

Similar Items

Microstructure and mechanical properties of porous copper and copper brazed with cu-based filler metal / Mian Muhammad Sami
by: Mian, Muhammad Sami
Published: (2021)

Effect of copper based filler composition on the strength of brazed joint
by: A. J. S., Hanifah, et al.
Published: (2019)

Mechanical and microstructure analysis of copper to copper foam brazing using copper-tin nickel-phosphorus amorphous filler alloys / Nur Amirah Mohd Zahri
by: Nur Amirah , Mohd Zahri
Published: (2021)

Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
by: Md Sani, Nur Ariffah
Published: (2015)

Enhancement of mechanical properties of Copper Brazed by laser surface modification
by: A. J. S., Hanifah, et al.
Published: (2020)

Comparative study between furnace brazing and laser brazing
by: Y. Erny, A. M. Y., et al.
Published: (2021)

Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb
by: Yoo, Kyoungkeun, et al.
Published: (2015)

Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2015)

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2015)

Dilemma of bumiputera contractor / Zubir Sayuti
by: Sayuti, Zubir
Published: (2007)

Copper removal by cellulose xanthogenate derived from Imperata cylindrica L. leaf powder / Zubir bin Othman
by: Othman, Zubir
Published: (2013)

Effect of electrodeposited Cu-Ni layer on interfacial reaction and mechanical properties of laser welded-brazed Mg/Ti joints / Auwal Shamsu Tukur
by: Auwal , Shamsu Tukur
Published: (2019)

A study on the wetting behaviour of Al-Si-Zn brazing filler on AA7075 and AR500 surface
by: Mohd Najib Muhamed,, et al.
Published: (2020)

Investigation Of Ni-Cu As Ohmic Contact On P-Type Gan_ Investigation Of Ni-Cu As Ohmic Contact On P-Type Gan_Investigation Of Ni-Cu As Ohmic Contact On P-Type Gan
by: Koe, Mei Yen
Published: (2017)

Analysis on the future energy demand in Malaysia / Nardia Zubir
by: Nardia , Zubir
Published: (2012)

Equal Channel Angular Pressing (Ecap) Process Of Copper Electrodes For Resistance Spot Brazing Application
by: Tran Thi, Thi Thien Ly
Published: (2007)

Equal Channel Angular Pressing (ECAP) Process Of Copper Electrodes For Resistance Spot Brazing Application.
by: Thien Ly, Tran Thi
Published: (2007)

Microstructure analysis and mechanical properties of dissimilar AA6061-AA7075 laser brazing with prefixed ER5356 filler
by: Haneef, M. S., et al.
Published: (2021)

Flextural properties of 3D printed Copper-Filler Polylactic Acid (Cu-PLA)
by: Kesavarma, Seluraju, et al.
Published: (2020)

Malaysia's civilian information warfare defense capability / Mokhzani b. Zubir
by: Zubir, Mokhzani
Published: (2003)

Viability of the novel process of indirect laser brazing
by: M. Y., Yuserny, et al.
Published: (2021)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Agriculture exports performance in Malaysia / Zubir Azhar, Noor Zahirah Mohd Sidek
by: Azhar, Zubir, et al.
Published: (2010)

Agriculture Exports Performance In Malaysia / Zubir Azhar and Noor Zahirah Mohd Sidek
by: Azhar, Zubir, et al.
Published: (2010)

Production of enhanced stability colloidal system for thermal application / Mohd Nashrul bin Mohd Zubir
by: Mohd Zubir, Mohd Nashrul
Published: (2015)

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)

Electroplating Of Cu-Sn Alloys And Compositionally Modulated Multilayers Of Cu-Sn-Zn-Ni Alloys On Mild Steel Substrate [TS693. H282 2007 f rb].
by: Hariyanti, Hariyanti
Published: (2007)

Factors that affect the usage of internet banking in Selangor / Katijah Mohamad Zubir
by: Mohamad Zubir, Katijah
Published: (2015)

The use of cartoons in English language learning / Zurina bt Haji Zubir.
by: Haji Zubir, Zurina
Published: (2004)

Employee retention: a study in Malaysian Palm Oil Board / Nur Hazimah Ahmad Zubir and Nur Farah Hanna Md Shaari
by: Ahmad Zubir, Nur Hazimah, et al.
Published: (2016)

A study on financial performance of Institut Terjemahan Negara Malaysia Berhad / Zakiah Mohd Zubir
by: Mohd Zubir, Zakiah
Published: (2010)

Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
by: Siti Faqihah, Roduan, et al.
Published: (2023)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate
by: Tay, S., et al.
Published: (2013)

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
by: Mayappan, Ramani
Published: (2007)

Study on the implementation of biometric device (Fingerprint) in attendance tracking for UiTM students / Norhazura Mohd Zubir
by: Mohd Zubir, Norhazura
Published: (2005)

Dr. Aiman invents laser brazing connection innovation
by: Safriza, Baharuddin, et al.
Published: (2020)