Effects of molybdenum nanoparticles on lead-free tin-based solder / Md. Arafat Mahmood

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Effects of molybdenum nanoparticles on lead-free tin-based solder / Md. Arafat Mahmood

Recent environmental concern led to worldwide legislation banning the use of lead (Pb) containing solders in microelectronic devices. Near eutectic Sn-Ag-Cu solders are considered as replacement for traditional Pb-Sn solders. But Sn-Ag-Cu solder alloys can not guarantee the required performance i...

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Bibliographic Details
Main Author:	Md. Arafat, Mahmood
Format:	Thesis
Published:	2012
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General)
Online Access:	http://studentsrepo.um.edu.my/8373/ http://studentsrepo.um.edu.my/8373/4/EFFECTS_OF_MOLYBDENUM_NANOPARTICLES_ON_LEAD%2DFREE_TIN%2DBASED_SOLDER.pdf

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