Effects of molybdenum nanoparticles on lead-free tin-based solder / Md. Arafat Mahmood
Recent environmental concern led to worldwide legislation banning the use of lead (Pb) containing solders in microelectronic devices. Near eutectic Sn-Ag-Cu solders are considered as replacement for traditional Pb-Sn solders. But Sn-Ag-Cu solder alloys can not guarantee the required performance i...
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| Format: | Thesis |
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2012
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| Online Access: | http://studentsrepo.um.edu.my/8373/ http://studentsrepo.um.edu.my/8373/4/EFFECTS_OF_MOLYBDENUM_NANOPARTICLES_ON_LEAD%2DFREE_TIN%2DBASED_SOLDER.pdf |