Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate / Mohammad Hossein Mahdavifard

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Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate / Mohammad Hossein Mahdavifard

In this study, Mo nanoparticles were used as a reinforcing material into the Sn-3.8Ag- 0.7Cu (SAC) solder on the nickel substrate (Cu substrate with an electrodeposited Ni layer on top). The Mo nanoparticles were characterized by transmission electron microscopy (TEM) and X-ray diffractometer (XRD)....

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Bibliographic Details
Main Author:	Mohammad Hossein, Mahdavifard
Format:	Thesis
Published:	2013
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/8180/ http://studentsrepo.um.edu.my/8180/4/EFFECT_OF_MOLYBDENUM_NANOPARTICLES_ON_THE_INTERFACE_BETWEEN_LEAD_FREE_SOLDER_AND_NICKEL_SUBSTRATE.pdf

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