Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / Muhammad Nasir

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Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / Muhammad Nasir

Miniaturization of microelectronic devices and the associated increase in current density during operation raise concerns over electromigration (EM) damage in solder joints. This thesis focuses on the effects of Ni and Co nanoparticle (NP) doped flux on the microstructure, mechanical and electrical...

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Bibliographic Details
Main Author:	Muhammad , Nasir
Format:	Thesis
Published:	2017
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://studentsrepo.um.edu.my/8112/ http://studentsrepo.um.edu.my/8112/1/All.pdf http://studentsrepo.um.edu.my/8112/6/nasir.pdf

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