Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean

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Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean

Due to environmental concerns, the electronics industry is actively shifting from lead solders to lead free solders. Sn based lead free solders are the most suitable 49is used in the under bump metallurgy (UBM) and substrate metallization for flip chip and ball grid array (BGA) applications. Inte...

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Bibliographic Details
Main Author:	Chew, Chee Sean
Format:	Thesis
Published:	2011
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/8014/ http://studentsrepo.um.edu.my/8014/1/KGA080081.pdf http://studentsrepo.um.edu.my/8014/7/KGA080081.pdf

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