Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging / Azida Azmi
Metal matrix composites (MMCs) have great potentials as packaging materials among other composite groups because the properties can be engineered to the design needs. Copper matrix reinforced with silicon carbide particles has greater potential due to the fact that it has higher thermal conductiv...
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| Format: | Thesis |
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2012
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| Online Access: | http://studentsrepo.um.edu.my/8006/ http://studentsrepo.um.edu.my/8006/1/FULL_REPORT_AZIDA_BINTI_AZMI_(KGG100003).pdf |
| Summary: | Metal matrix composites (MMCs) have great potentials as packaging materials
among other composite groups because the properties can be engineered to the design
needs. Copper matrix reinforced with silicon carbide particles has greater potential due
to the fact that it has higher thermal conductivity compared to the widely used
aluminum. However, the bonding between the copper matrix and the SiC reinforcement
must be improved since there is interface issues which affect the thermophysical
properties of the CuSiC composites. Therefore, the SiC is coated with a thin copper film
via electroless coating technique which is least expensive, simple and can provide
homogenous copper deposits. The SiC is first need to be cleaned, etched, sensitized and
activated to prepare the SiC particles surface for copper to be deposited onto it. Then, an
electroless copper coating bath is prepared and the SiC is coated under suitable
temperature and pH to obtain a good coating on SiC particles. Then, the CuSiC
composites are fabricated via powder metallurgy methodology by ball milling to mix
the copper matrix and SiC reinforcement. Then the mixture is pressed under uniaxial
compaction loading and sintered at 925oC for 2 hours. Then the samples are ready for
characterization and testing.
The SEM images showed the difference between the raw SiC and cleaned SiC
after ultrasonically cleaned in solvent. After sensitizing and activation process, the SEM
image showed that it has the catalytic elements during the activation process. Then, the
SEM image after coating process showed the copper deposits on the SiC particles
surface. The particle size distribution has increased from 45.639mm before cleaning to
45.993mm after cleaning. Then the size increased to 46.750mm after sensitizing and
activation process. Then, the size increased to 48.100mm after coating process. |
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