Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque
Lead (Pb)-free electronic product is a catchphrase of consumer and different regulators worldwide which turns in to an obligatory for the electronic industries to remove Pb from semiconductor assembly for the reason that it is highly toxic, harmful for human health and environment. Alternative as...
| Main Author: | Ashraful, Haque |
|---|---|
| Format: | Thesis |
| Published: |
2011
|
| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/7997/ http://studentsrepo.um.edu.my/7997/6/Dissertation_Ashraful_Haque_(KGA080071).pdf |
Similar Items
Thermomigration in lead-free solder joints
by: Abdul Hamid, M. F, et al.
Published: (2008)
by: Abdul Hamid, M. F, et al.
Published: (2008)
Optimization On Laser Soldering Parameters Onto Lead-Free Solder Joint
by: T. J., Nabila, et al.
Published: (2017)
by: T. J., Nabila, et al.
Published: (2017)
Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017)
by: Tan, Ai Ting
Published: (2017)
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024)
by: Muhammad Asyraf, Abdullah
Published: (2024)
Lead free solder joint thermal condition in semiconductor packaging
by: Harif, Muhammad Najib, et al.
Published: (2010)
by: Harif, Muhammad Najib, et al.
Published: (2010)
Structural Integrity Investigation Of SAC305 Lead Free Solder
by: Ganiashan, Eesvaran
Published: (2022)
by: Ganiashan, Eesvaran
Published: (2022)
Bismuth-antimony as an alternative material for high temperature lead-free solder
by: Muhamad Zam, Shahrul Fadzli
Published: (2012)
by: Muhamad Zam, Shahrul Fadzli
Published: (2012)
Bismuth-argentum alloys as alternative high temperature lead-free solder
by: Rosilli, Rohaizuan
Published: (2012)
by: Rosilli, Rohaizuan
Published: (2012)
Study of interfacial reactions between lead-free solders and immersion silver finish
by: Oshaghi, Safoura
Published: (2008)
by: Oshaghi, Safoura
Published: (2008)
A Study On Mechanical Behaviour Of Lead-Free Solder Using Nanoindentation Test
by: Ong, Mei Kiem
Published: (2018)
by: Ong, Mei Kiem
Published: (2018)
Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)
by: Abu Hassan, Nurfazlin
Published: (2009)
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
by: Nahavandi, Mahdi
Published: (2014)
by: Nahavandi, Mahdi
Published: (2014)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2018)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2018)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)
by: Idris, Siti Rabiatull Aisha
Published: (2008)
Numerical Analysis Of Ultra-Fine Package Assembly With SAC305-TiO2 Nano-Reinforced Lead Free Solder At Different Peak Temperature
by: Aziz, Asyraf Hasif
Published: (2018)
by: Aziz, Asyraf Hasif
Published: (2018)
Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2013)
by: Mohammad Hossein, Mahdavifard
Published: (2013)
Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon
by: Nashrah Hani , Jamadon
Published: (2017)
by: Nashrah Hani , Jamadon
Published: (2017)
Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering
by: Chong, Jia Jun
Published: (2019)
by: Chong, Jia Jun
Published: (2019)
Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean
by: Chew, Chee Sean
Published: (2011)
by: Chew, Chee Sean
Published: (2011)
Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
by: Bakir, Mohammed Luay
Published: (2012)
by: Bakir, Mohammed Luay
Published: (2012)
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
by: Ariff Syakirin, Ghazalli
Published: (2007)
by: Ariff Syakirin, Ghazalli
Published: (2007)
Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach
by: Norliza Ismail,, et al.
Published: (2020)
by: Norliza Ismail,, et al.
Published: (2020)
A Review: Lead Free Solder and Its Wettability Properties
by: Ervina Efzan, Ervina Efzan, et al.
Published: (2016)
by: Ervina Efzan, Ervina Efzan, et al.
Published: (2016)
Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
by: Siah, Meng Zhe
Published: (2019)
by: Siah, Meng Zhe
Published: (2019)
Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis
by: Abdul Aziz, M. S., et al.
Published: (2014)
by: Abdul Aziz, M. S., et al.
Published: (2014)
Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling
by: Dai, Jingru, et al.
Published: (2018)
by: Dai, Jingru, et al.
Published: (2018)
Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
by: Nahavandi, Mahdi, et al.
Published: (2014)
by: Nahavandi, Mahdi, et al.
Published: (2014)
Analysis of particulate matter, carbon emissions and elemental compositions from A diesel engine exhaust fuelled with diesel-biodesel blends / Mohammad Ashraful Alam
by: Mohammad Ashraful , Alam
Published: (2016)
by: Mohammad Ashraful , Alam
Published: (2016)
Circular edge bow-tie nano antenna for energy harvesting systems / Ahasanul Haque
by: Ahasanul, Haque
Published: (2016)
by: Ahasanul, Haque
Published: (2016)
Fatigue fracture process of lead-free solder joints in BGA package
by: Tamin, M.N., et al.
Published: (2012)
by: Tamin, M.N., et al.
Published: (2012)
Size and volume effects on the strength of microscale lead-free solder joints
by: Yin, L., et al.
Published: (2009)
by: Yin, L., et al.
Published: (2009)
Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
by: Wahab, Abdul Karim Abdul
Published: (2011)
by: Wahab, Abdul Karim Abdul
Published: (2011)
Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
by: Erik Nino, Tolentino
Published: (2020)
by: Erik Nino, Tolentino
Published: (2020)
Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process
by: Muhammad Rafiq, Mohammad Sabri
Published: (2018)
by: Muhammad Rafiq, Mohammad Sabri
Published: (2018)
Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process
by: Fauzi, Muhamad Razizy, et al.
Published: (2022)
by: Fauzi, Muhamad Razizy, et al.
Published: (2022)
Minimization of copper dissolution for lead-free wave soldering in surface mount technology
by: Arunasalam, Mageswaran
Published: (2017)
by: Arunasalam, Mageswaran
Published: (2017)
Similar Items
-
Thermomigration in lead-free solder joints
by: Abdul Hamid, M. F, et al.
Published: (2008) -
Optimization On Laser Soldering Parameters Onto Lead-Free Solder Joint
by: T. J., Nabila, et al.
Published: (2017) -
Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017) -
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024) -
Lead free solder joint thermal condition in semiconductor packaging
by: Harif, Muhammad Najib, et al.
Published: (2010)