Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon

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Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon

The use of lead-based (Pb-based) solder alloy has been reduced mainly in electronics packaging due to Pb toxicity to the environment and human health. Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder alloy is considered compatible combination of lead-free solder to replace conventional Pb-based solder alloy....

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Bibliographic Details
Main Author:	Nashrah Hani , Jamadon
Format:	Thesis
Published:	2017
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/7960/ http://studentsrepo.um.edu.my/7960/2/All.pdf http://studentsrepo.um.edu.my/7960/9/nashrah.pdf

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