Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting

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Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting

The present thesis focused on the development of ultrasonic assisted reflow soldering technique to improve the reliability of lead free solder joint in the electronic packaging application by integrating ultrasonic vibration (USV) into the reflow stage of a reflow soldering process. In the prelimina...

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Bibliographic Details
Main Author:	Tan, Ai Ting
Format:	Thesis
Published:	2017
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/7797/ http://studentsrepo.um.edu.my/7797/1/All.pdf http://studentsrepo.um.edu.my/7797/7/Tan_Ai_Ting_%2D_Thesis.pdf

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